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Altium designer 超齐全封装库(含基本连接器、基本元器件和100多家公司的器件封装) 百度网盘下载如下——— 包含的封装库如下图: 各大厂家封装库文件大小: Actel (10MB)
6 C$ G I, M' M( Z1 n( LAgilent Technologies (0.5MB)
& ~! n* ^# z) c! lAllegro MicroSystems (2.6MB)$ I2 d0 R0 i3 O# P6 M
Alpha Microelectronics (30KB)/ s& J! T0 c6 q6 u1 a( f/ u$ a
Altera (39MB)+ A: I- ^% p9 ~: s; }% r
AMCC (1MB); H8 E3 y# d; Q
AMP (3.5MB)
4 ^$ z2 i: t( c( CAmphenol (30KB)& F8 J+ L! ~* }$ F, y
Analog Devices (9MB)
* S4 S( P y2 s/ _7 F, _+ IAntenna Factor (8KB), S+ G* f0 q7 e+ A& ]+ `. {6 L
Antenova (9KB)0 f7 w, b8 R0 E; l( W {3 L
Astron Technology (19KB)' h" E: e7 J% N4 a- u, ?' H
Atmel (2.4MB)/ u: W" s( ]: S! W! d @4 C5 @
Attend (18KB); F, } g* _+ D; r. X, Q8 x, w
Avago (580KB)' Y4 H1 v5 b7 L) V
Bitwise Systems (875KB)( A+ z1 v7 T) |
Bulgin (14KB)
3 \: g8 c- o# G; w. I& x- qBurr-Brown (4.2MB)
0 ?. T. C, G& kC&K Components (13KB)
" K% I& c0 C! oChin Nan Precision Electronics (8KB); h0 W8 M( @+ V! }+ O
Cirrus Logic (58KB)
. i- P+ r+ H9 P- FCliff Electronic Components (17KB)
5 ]1 T: r/ x: V7 m$ }8 h3 UC-MAC MicroTechnology (22KB)# K7 G2 W; l* L: w
Contact Technology (11KB)5 A6 X' X$ F* A7 k( F1 O
Cooper Bussman Coiltronics (82KB): v" _8 m" v( u9 g
Cypress (11.5MB)) e9 L, ^- H( x( {+ O$ V' |
Dallas Semiconductor (1.1MB)/ Q9 @3 g5 ?, t
Device Sheets (1.3MB)
7 w3 V4 i1 r* A$ P' k7 B* |/ rDigi International (11KB)( I: M; |2 [& V x" z
ECS (40KB)
$ Y# g8 Q1 e( S; hElantec (1.4MB)
+ B9 w/ i7 i `( d4 UEPCOS (15KB)$ s7 A, d- u$ f; X0 X0 Q& P! R
Fairchild Semiconductor (4MB)0 \2 y. c2 K6 X1 z9 `4 q
Freescale Semiconductor (1.8MB)# [8 f0 C! h! Z7 l1 t9 F& F( y( E
FTDI (90KB)
! ?% c4 P6 g" U& q T( lGeneralplus Technology (55KB)/ c# i* }9 W; }& q6 F6 b
Gennum (1.5MB)6 i) P$ r u/ o% L
Harris Suppression (21KB)( O+ \$ C! v! }: T2 [4 R7 ~9 K: \
HARTING (780KB)
" E' S# @1 c1 x3 V# ?5 l. ]2 h" vHirose Electric (85KB)
. a9 ^- E" o) I/ I- EHitachi Semiconductor (450KB)+ H$ c% i: o7 `' V( y1 e, Y8 z
Holtek Semiconductor (9KB)2 _ ~. l8 V( w
IL Switch (11KB)
Y: ]: O( I( J. D- v3 CInfineon (160KB)
5 d3 I! K5 B, kIntegrated Device Technology (33KB). {% M X8 P" \3 Q0 o. d8 n" g
International Rectifier (2.8MB)
q, J) n/ |) f+ ~ M5 |Intersil 1MB)
1 H: r# d, @+ O" W' EJohanson Technology (8KB)
0 f# x% R7 T* v! N" c7 qKEMET Electronics (39KB)( I6 ?! X2 e% o; h0 Z# P
Keystone Electronics (9KB)- e& I8 L) _9 h1 \/ G
King Billion Electronics (7KB)
" R$ x' \. [' I" C6 wKingfont (9KB)1 ?6 E7 `- U; q" E4 x6 P! x
Kitagawa (12KB)% b& ] N7 ]( m* T) C* Z2 B5 {
Kobiconn (14KB)
8 R: \" W- r9 r, G% Q1 a+ XKycon (11KB)
5 [7 Q7 Y3 ]/ ]1 u8 cLattice 33MB)
! L* g/ {3 V+ ~8 y/ FLinear Technology (2MB); r- q: p5 [ {) s
Lumberg (9KB); P' u: Y8 d0 r
Maxim (6.4MB); _$ D/ }7 Y9 A/ _) e
Micrel (9KB)
; z [7 s+ p7 `1 V2 P7 Y, t5 TMicrochip (5.6MB)
/ q8 U' |" E6 n: p' L) l: o) O. F+ ^. [Micron Technology (37KB)
1 P0 L+ Q/ t) I# s( I3 OMolex (640MB)
: U/ _/ g8 N: r" Q* TMorethanall (12KB)
$ H' q& K5 h4 e/ S" l5 h5 R$ EMotorola (15MB)4 d' p0 ]7 u- R) S. W- _* ^
National Semiconductor (7.8MB)3 I8 G. M; |+ x& `
NEC (166KB)
' |" i% H g# T( TNewport Components (121KB). w% g5 I% L* m( m: k% _1 o5 ?/ B
NXP (206KB)
( y$ C `- Z U, p! q/ f$ ]5 h, rOki Semiconductor (148KB)' _2 Y0 U6 x2 H% F2 [
OMRON (11KB)% T9 O4 y0 t, ~- Q; m; Y
ON Semiconductor (1.7MB)2 f; S% O- H7 y
OSRAM Opto Semiconductors (9KB)6 Q ^" |( a1 J( L8 W
Panasonic (85KB)' R2 y* P: r& s9 [
PCB (9.4MB)
6 N0 i( T7 m% m( K8 HPhilips (1MB)
% _ T; O( B' c' B9 [0 M, A4 U. cProjects Unlimited (9KB)
% ]5 [5 O# l. MQuickLogic (806KB)) R: E3 V$ n+ Z9 S: Z. i+ A5 h, {" n+ Q
Raltron Electronics (15KB)* a3 z% n$ o. G M! y( o+ r ~- y) l
Renesas Technology (4.2MB)* L2 K+ B5 ?/ l4 ?1 Q; J
RF MicroDevices (162KB)
* a+ S, f, ]- r8 c6 j! K/ O+ L( @% ~Samsung (74KB)
% {, H" L* i, n* kSamtec (12KB)
0 R3 S- o/ _4 M( v5 j% N6 W* `Sansen Technology (8KB)* S* V( i8 ]9 z, Y5 \; \ h3 {
SHARP (523KB)
4 z+ a6 G7 H" g& H# |" LSonix Technology (5KB)9 N z- N# v, Z+ R
Spansion (330KB)
6 r4 ^# \; {$ qST Microelectronics (46MB)
" c3 @) U/ c5 B- O6 ^1 S6 t1 {) oSunplus Technology (40KB)* s. d, n! j5 M7 D' Q
Sunridge Corporation (203KB)
# n) Z9 F% I3 BSusumu (13KB)/ v; I. Z( m& S6 d& a
Suyin Corporation (13KB)
; X* r% E4 ]+ f) jTeccor Electronics (75KB)7 l( p5 S" v, y: _$ a2 ~, A0 |
Technik Industrial (15KB); [+ z+ ~6 }# @
Telit Communications (13KB)
9 l5 b& `0 Q3 _2 HTexas Instruments (18MB)' Y$ ~, g2 m' _' k6 W) e
Toshiba (13KB)- l5 a- X+ @- L% O( h* e, I
Vishay (2.6MB)
5 x. b/ ^: b/ z% p+ rVitesse Semiconductor (10KB)* W# e/ w+ h% v/ d
Western Digital (1.3MB); |1 V; \3 X- Q+ ]
Wieson Technologies (11KB)
; m- @0 V9 b& fWinbond Electronics (12KB)/ t8 y0 j7 R1 ?5 v f! @/ U
Xilinx (44MB)
d$ k# t: X. x+ `& w( NZarlink Semiconductor (335KB)
- j% U9 t+ T. b8 s5 b7 \+ i3 @Zetex (215KB)8 F2 r X) j! ^) ~- I' H& L
Zilog (1.7MB)
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