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Altium designer 超齐全封装库（含基本连接器、基本元器件和100多家公司的器件封装） 百度网盘下载如下——— 包含的封装库如下图： 各大厂家封装库文件大小： Actel (10MB)2 N9 Z* F! j# v7 H6 F- G$ a4 M& O8 T+ |
Agilent Technologies (0.5MB)
$ O- U" z7 R* {' F9 {Allegro MicroSystems (2.6MB)
# S0 ^5 H5 ]0 c) Y. sAlpha Microelectronics (30KB)
8 D+ b% G! T, z$ E+ m* UAltera (39MB)* l! I6 u4 @$ c8 ?
AMCC (1MB)% P7 z; r: H' H; m+ G( u* m
AMP (3.5MB)9 V& ~+ V& ?: t: t) N
Amphenol (30KB)/ ^( k: \" h/ _; b) C& \! ^
Analog Devices (9MB); J+ D, u4 M" E' ^- Q1 [/ z) f: X
Antenna Factor (8KB)8 j. E, h/ Q+ m+ p
Antenova (9KB)0 N V3 U: ], y: m$ q) P
Astron Technology (19KB)5 i) j$ Z0 @2 _0 q& P
Atmel (2.4MB)- @+ c* \; N5 }9 D( e( \. V3 ^
Attend (18KB)
k) \8 m3 `7 h, B/ ~+ UAvago (580KB)
8 G% ^7 U/ @6 xBitwise Systems (875KB)
' R; K8 e: z2 p$ k3 l7 F* mBulgin (14KB)9 v1 o5 ]3 H) a
Burr-Brown (4.2MB)" x2 J- C1 z; O% }* Y
C&K Components (13KB)4 p3 P8 @8 o# p( a1 q! G
Chin Nan Precision Electronics (8KB)
; f) b3 P- A0 ]5 DCirrus Logic (58KB)& L- n K# f3 M9 L8 o
Cliff Electronic Components (17KB)' C' c! b4 R/ J( Q
C-MAC MicroTechnology (22KB)4 W. c& G# a' p
Contact Technology (11KB)
4 E' n* c0 {8 Z8 hCooper Bussman Coiltronics (82KB)
' P: K2 [3 X: j& h# xCypress (11.5MB)5 D8 }9 p* c- v
Dallas Semiconductor (1.1MB)/ R: Z8 a$ k2 t
Device Sheets (1.3MB)
0 `; I% ~# ]8 Q4 c/ I! xDigi International (11KB)
# o; f! u4 d: n: L1 x9 g i5 _ECS (40KB)
: F5 y6 g4 d% \+ i! |! BElantec (1.4MB)- n$ d8 [7 t i8 g( ^
EPCOS (15KB)
4 D& z( ]; v( OFairchild Semiconductor (4MB)7 M; d" R; |- j+ n
Freescale Semiconductor (1.8MB). s% Y1 T7 p8 W0 x# o3 K: b+ \; Q
FTDI (90KB)/ l. R3 T+ [0 ~& i
Generalplus Technology (55KB)
$ ?, y& S8 E5 R" _* S0 xGennum (1.5MB)
. t. r- o: |% ?; h8 H: s. tHarris Suppression (21KB)( b2 j1 e: E1 A: A& L! S9 [' {
HARTING (780KB)
) g1 i) q( N8 _4 K9 d9 [+ a- tHirose Electric (85KB)6 P& F. P0 T; Q4 L# p+ D7 `, ~$ g$ J
Hitachi Semiconductor (450KB)" T2 T& ?! n/ {" t* h7 @
Holtek Semiconductor (9KB)
8 Y6 I; Q! s# Q, DIL Switch (11KB): B8 t9 t: l* a& B
Infineon (160KB): J1 [( w- I) ^+ c! D! x0 V+ G! R
Integrated Device Technology (33KB)" i: [- _( q) B
International Rectifier (2.8MB)
/ p A4 h) L; n+ i0 IIntersil 1MB); C3 b1 D/ y4 j5 v; Y& K8 ]
Johanson Technology (8KB)
9 z7 _# l5 F* V JKEMET Electronics (39KB) y# n! J2 }1 b9 p/ u
Keystone Electronics (9KB)
" |% \1 Z7 H' _King Billion Electronics (7KB); q$ e4 L! |9 q
Kingfont (9KB)
8 h! `) O$ Q1 O) F0 o( {4 N- WKitagawa (12KB)% p2 g# ]2 m. }; n* J) B4 y
Kobiconn (14KB)" F8 V. f* }+ u; v, |
Kycon (11KB)
; F' e' r$ O0 ?1 Z! ~# z0 J6 O" pLattice 33MB)
* @, `, e6 q+ D3 _$ m* DLinear Technology (2MB)
* _; i. X: X1 @7 a$ W0 R" `Lumberg (9KB), F' j6 Y8 X7 l7 N" E I
Maxim (6.4MB)) I- h. D8 s6 o1 j. `+ {+ `
Micrel (9KB)8 Q, a% F+ T8 q: ?8 W
Microchip (5.6MB)
% u l& i9 `8 f( H6 t. u( sMicron Technology (37KB)
1 L& |2 g3 i, }) H9 NMolex (640MB)! o5 T$ x* Y$ q* Y
Morethanall (12KB)
& W9 ~" F' G) @$ q7 gMotorola (15MB)
/ y: p) w. ~3 oNational Semiconductor (7.8MB)
3 x' E, _) d% q; \# xNEC (166KB)! y8 _8 N& P7 |
Newport Components (121KB)/ [6 v+ i0 A& ^ D; H
NXP (206KB)
8 t4 j- }( p. g# Q! a0 ~Oki Semiconductor (148KB)
7 ]- R0 o: \9 W. j4 w7 fOMRON (11KB)
$ x" {# u# |8 v1 a4 ?ON Semiconductor (1.7MB)
X5 U9 R% [0 W0 S6 v3 yOSRAM Opto Semiconductors (9KB)
9 A8 v. K# W% E, Y- h/ qPanasonic (85KB)/ I9 T0 o8 f! l6 j
PCB (9.4MB)# e- k' j- K/ O; r
Philips (1MB)$ c% o% S9 h4 E. U
Projects Unlimited (9KB)
) ^7 m! d5 t4 C0 e. Z+ oQuickLogic (806KB)1 d: Y# ?: W# g; }
Raltron Electronics (15KB)& O+ M* |. l) V( f2 b# U* {
Renesas Technology (4.2MB)6 s4 c& I9 _, r! {
RF MicroDevices (162KB)
: I' V! [9 T% {' H) JSamsung (74KB)" a, Z: a) {4 `( m! k
Samtec (12KB)( B+ h- |3 |6 O5 K* A
Sansen Technology (8KB)
' u5 ?5 G9 m* y/ k, A4 s$ XSHARP (523KB)
% {- W# i* ^5 H! R" cSonix Technology (5KB)" J. h% O8 O! N# O+ k* a; R3 u) `
Spansion (330KB)
3 {/ L, v9 l2 x/ V; [9 nST Microelectronics (46MB)
: t! W- R# d5 A# s, BSunplus Technology (40KB)/ K" y# W# n' k( T* l
Sunridge Corporation (203KB)8 |8 ^2 N! j+ a6 ?& w8 q
Susumu (13KB)' _) A+ ?; Y. b }
Suyin Corporation (13KB)8 ^* k0 @" r* m$ m
Teccor Electronics (75KB)) {7 K& o! ?' `2 @* {5 R1 }
Technik Industrial (15KB)4 h" f5 E# f% v& F( M4 y- |
Telit Communications (13KB)) r4 s1 V* @6 H1 F' T$ R
Texas Instruments (18MB)6 B9 Y" z+ s" L1 v9 {, V. d* f7 U
Toshiba (13KB)
3 X4 Z" e2 g+ j) j i/ A6 ^8 K# x0 Q5 N* lVishay (2.6MB)8 L3 j& @1 f* W/ p
Vitesse Semiconductor (10KB)( C' W D2 q+ I! H) k. ~6 k. l" E
Western Digital (1.3MB)" N' W# V* v @8 H# \
Wieson Technologies (11KB). m! d, J6 R! P) A Y+ W8 j
Winbond Electronics (12KB), g) a! T+ d! {2 p
Xilinx (44MB)% E) }! s" z6 H6 c2 w5 ~8 |0 d
Zarlink Semiconductor (335KB)
7 i# D C$ N% V E3 L# P5 F7 J7 {Zetex (215KB)
u7 {! h+ r3 i) B, l% p8 R" c. _Zilog (1.7MB) 4 s+ ], _+ R* g5 w: v. j# Z
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