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PCB专业英语
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1. PCB 分类' W0 l S& ` |, }. n8 B% R
2. PCB 材料; Y& T% Q& v- {# X% M5 X4 z+ x
3. PCB 生产流程6 Y7 O2 r: o. i0 B9 m
4. 水处理
e4 h0 I8 a+ ]" s" e5. PCB 检验# E U2 z( z4 ?& E5 J
6. 主要设备
# @# T Y6 X& o, G9 `7. 工程设计6 T9 n9 N/ p3 a$ _
8. 元器件组装
" ~: n0 G* L' }8 s" A* Q+ O1.PCB Sort (PCB 分类):8 c+ z+ O; Q/ V! S. S
Single sided board(单面板) Double sided Board(双面板) Multilayer Board(多层板)Rigid board(刚性板) 8 s% P: v4 m! s0 r) `
flexible board(挠性板) flex-rigid board(刚挠结合板) metal base PCB(金属基板) Blind board(盲孔板) 8 @- {: f/ c" V4 k
buried board(埋孔板) bare board(裸板)Quick turn prototype(样板)
3 j: w( B0 c& [0 I6 Y* s) ^2.PCB Material(PCB 材料):
! o1 i+ m# W4 E7 E7 {$ P8 JCopper clad laminate(CCL)(覆铜板) PREPREG(半固化片) Epoxy resin(环氧树脂) Copper foil(铜箔)2 g! ~, g0 m" J" \
PTFE (Polytetralluoetylene) Teflon(聚四氟乙烯) dielectric constant(介电常数)Flexible copper clad(挠性覆铜板) silver film(银盐片) diazo film(重氮片)Solder mask(阻焊) Dry film(干膜) legend ink(字符油墨)
, }; p8 \' | d3 T* ?peelable solder mask(可剥离阻焊) flux(助焊剂) additive(添加剂)& \- M5 B3 u' Y& l
3.PCB Process(PCB 生产流程) :
$ e! v- H& _- n \3 d8 XWet process(湿法流程) Dry process(干法流程)
1 K0 ]! t+ c3 k$ t/ wFOR MULTILAYER MANUFACTURE PROCESS(多层线路板生产流程):Laminate cut(覆铜板) scrubbing(擦板) Image transfer(图形转移) internal layer(内层) Exposure(曝光) Developing(显影) ETCHING(蚀刻)
S- R' Z; @8 F7 I9 u% A x: y3 bblack / brown oxygen(黑/棕化) lay up(叠层) Laminating(层压) Drilling(钻孔) scrubbing(擦板) ) m5 p5 f, F. @% T+ O& j
Plated throughhole(孔金属化) PTH panel plating(板面电镀) pattern plating (plated resist) (图形电镀) 6 i! H- t! q2 k& n) y/ |% Z8 B) E
Etching(蚀刻)Inspection(检验) Printing solder mask(阻焊印刷) Exposure(曝光) Developing(显影)" P2 x4 ~3 Q9 ?
Hot Cured(热固化) Hot Air Leveling(热风整平) IMMERSION GOLD(沉金)
" X; t' a( p2 GPrinting legend ink (silkscreen printing)(字符印刷)Hot Cured(热固化) Routing(铣外形)/ \9 B, D! y. w0 k6 b! P: z$ f
punch(冲孔) Bare board testing(裸板测试) Final Inspection(终检) Packing(包装) Delivery(发货)
5 G, c F: C, H. B& [$ H4.Water treatment(水处理) / \8 e+ F5 G6 K* Y
DI (dialysis ion) water(去离子水) Waste watertreatment(污水处理) humidity (湿度)temperature(温度) - y7 V9 C1 s0 b
5.PCB Inspection(PCB 检验):2 r) u& `8 f8 l1 I' A1 N: K
Inspection standard(检验标准) defect open(开路)short(短路)measling(白斑)fibre exposure(漏基材) hole breakout(破孔) flatness(平面度) peelstrength(剥离强度) thermal shock(热冲击)/ [9 Z5 W) _0 `- Y# R P
thermalstress(热应力) Reworking(返工) manufacture panel(制造拼板) light integrator(光积分仪) stepscale(光尺) undercut factor(侧蚀系数) microetching(微蚀) over etching(过蚀)
g& y; `1 s/ Pswimming(滑移) 1 q, I3 h( i& D9 z2 T
% r. H+ d' e) Z% c @, f& J7 g6.Major equipments(主要设备):7 e$ V6 X# H2 [& M% A' u X
Laser plotter(激光光绘机) CNC drilling machine(数控钻床) CNC routing machine(数控铣床)
: X; L% J- J+ D" WScrubber(擦板机) Auto through hole plating line(自动沉铜线)panel plating line(板面电镀线)
& Q, V% [( d- P h+ u5 vpattern plating line(plated resist) (图形电镀线) dry film laminator(贴膜机) Exposure(曝光机) 6 O" O9 v/ f6 a; }
developing line(显影线) Etching line(蚀刻线) Auto registration punch(冲孔机)
7 L+ X: ]! p* |Multilayer press system(多层板层压系统) Blackoxidation line(黑化线)
& r( u& R- k) b% O+ z3 \0 t, |Automatic optical instrumentAOI(自动光学检测仪) Flying Probe test FPT(飞针检测仪)
: M9 t( H/ D& W5 `7 M! A4 U# sHot air leveling(热风整平机) Impedancecontrol test system(阻抗控制检测仪)& H/ [5 l' w- F! n7 S) w9 e
7.Engineering Design(工程设计):; L4 n0 a/ y1 |: t& Q( d2 s
lay out(布线) CAD (computer aided design) (计算机辅助设计)
3 O: M! P8 u# |' u2 \4 ^2 ]: R1 Q4 pCAM (computer aided manufacture) (计算机辅助制造) & `. ^. r4 d/ K7 j$ s" \0 r' M# @
EDA (Electronic design automatic) (电子设计自动化) origin(原点) mirroring(镜相). T- F4 |) E( ^/ o: E
scalingfactor(比例系数) network(网络) conductor track(导线) PAD(焊盘) width(宽度)
* `3 |1 i c$ t4 o, Ngap spacing(间隙) aperture(光圈) round(圆形) oblong(长圆形)square(正方形)
m+ A5 h- k; D% d9 Orectangle(长方形) tear pad(泪滴焊盘) isolation pad(隔离焊盘) thermal pad(热焊盘) ( K& d0 m S x; u6 p2 ^
mounting hole(安装孔) via(过孔) Plating throughhole PTH(金属化孔) NPTH(非金属化孔)
0 l# k' N0 [7 W4 @+ R* utooling hole(定位孔) Fiducial (基准点、反光点) layer to layerspacing(层间距)
( h3 ^2 ^0 }7 wlayer Building up drawing(层叠图) external layer(外层) internal layer(内层)power layer(电源层) ground layer(接地层) signalline(信号线) target(标靶) slot(槽孔)# ~5 m; t. ^2 F/ s9 X s1 P
tabconnector (golden finger) (金手指) Impedancecontrol PCB(阻抗控制) Golden board(黄金板)
3 Z2 o* _. E, r) X8 z( U: k, ZMI(manufacture information) (制造说明) NOPE ( noprocess engineering ) (重订单) ! [+ m/ `6 v+ `6 J# a0 _& W
photo plotting(laser plotting)(激光光绘) positive(正片) negative(负片)
' [& [) E( }' d0 m. }2 A) D& x3 X8.Component Assembly(元器件组装):
( ~' d2 D& r+ r9 xsmt (Surface mount technology) (表面贴装技术) Bonding(邦定)
5 ^8 A/ i. D5 V9 [, r/ \4 C+ n" `DIP(dual inline package) (双列直插封装) QFP(quad flat package) (四面扁平封装). t% x ~4 W, N5 x( z
BGA(ballgrid array ) (球栅封装) SMD (Surface mount devices) (表面贴装设备)Placement machine(贴装机)
; E: h6 m3 m, T! `REFOLW SOLDERING(回流焊) WAVE SOLDERING(波峰焊)
" B i5 A9 j# Y# M7 h# n t9 b- t 详情可见www.sz-jlc.com/s
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