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*.GTL TopLayer顶层走线 - s, @: W: s/ m% `$ p* P: `/ P
*.GBL BottomLayer底层走线
+ k6 l! `4 U% L5 u: ^*.GTO TopOverlay顶层丝印字
7 ~% T3 U. ?+ S+ X" ?*.GBO BottomOverlay底层丝印
" A- m! z3 N6 h5 n* N$ b3 k6 M *.GTS TopSolder顶层阻焊 $ J4 r# C3 a. z5 i9 b* \
*.GBS BottomSolder底层阻焊
& }# K- Q3 ?0 _8 i: i1 `*.GTP TopPaste顶层贴片钢网
8 x5 m( `$ e* ^*.GBP BottomPaste底层贴片钢网
5 z0 h3 x* J' P0 G' ?*.GPT Top Pad Master顶层主焊盘 1 y- n- P2 w* ?* F
*.GPB Bottom Pad Master底层主焊盘
" I9 h: r4 Z+ T' x7 ^* g P# s* k*.G1,*.G2,.. MidLayer1,2,..内层走线
! { h) V, g" E7 q; D) n1 {*.GP1,*.GP2,.. InternalPlane1,2,..内层平面1,2,..
' P, k- J) ~1 Z& T8 Q$ d*.GM1 ,*GM2,.. Mechanical1,2,..机械层1,2,.' X9 d, |% J4 K
. *.GKO KeepOutLayer禁止布线层(可做板子外形) 8 |( [3 ^9 q' N# r1 i5 u2 l" {
*.GG1 DrillGuide钻孔位置层 9 g6 U( I" i7 R$ \$ |
*.GD1 DrillDrawing钻孔图层 ! ~" u$ N: _* Y3 Y" L8 N
*drill 钻孔文件
5 q: M1 b- v% i2 Y% v6 s+ p: P*.TXT 分孔图表
1 I& ~" R @2 S J# Z3 y; b) L) [ *.APR 光圈表文件
. _% C9 f: D* x+ T D*.DRR 钻孔报告文件QQ 800058721 | 2 p; N* w- w( x: b5 j1 ?; e0 C3 [ g4 w
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