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8 Z2 k) u! d- ?. C1 Z2 u- A& W; [7 f; f( ^! i2 F+ K
*.GTL TopLayer顶层走线 ! ?6 { Z' \& V
*.GBL BottomLayer底层走线 # A; b' `, h, O" j
*.GTO TopOverlay顶层丝印字 5 Z5 G6 }# R% |* x9 @- J9 z. B8 L2 f. T
*.GBO BottomOverlay底层丝印3 a6 Z( N. B; ^0 g
*.GTS TopSolder顶层阻焊 ' w( W9 }% x4 S/ g+ X$ r- `
*.GBS BottomSolder底层阻焊 - K1 {+ |& C, f4 l9 Z
*.GTP TopPaste顶层贴片钢网
) p, w# t# D3 {) n* T: s*.GBP BottomPaste底层贴片钢网 5 g9 O9 N* k7 N' @- x4 {( d7 t
*.GPT Top Pad Master顶层主焊盘 ; o; m; @' `5 @: A3 G8 s/ d8 W
*.GPB Bottom Pad Master底层主焊盘 7 Z% l! w7 m1 o; B9 {
*.G1,*.G2,.. MidLayer1,2,..内层走线
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*.GM1 ,*GM2,.. Mechanical1,2,..机械层1,2,.$ A. g& b# ^" M- h
. *.GKO KeepOutLayer禁止布线层(可做板子外形) 1 r+ w6 L$ ?7 s7 V. @
*.GG1 DrillGuide钻孔位置层
, L$ E/ F, c' N3 c8 ^( v. p0 J G*.GD1 DrillDrawing钻孔图层
+ d1 |" n/ X# C$ S*drill 钻孔文件
5 x5 l* i+ Y* D6 H h, }3 [, Q*.TXT 分孔图表
, {3 e5 Y% }4 U9 I1 Q; ` *.APR 光圈表文件 7 i% ?/ d) d6 { B
*.DRR 钻孔报告文件QQ 800058721 | 0 x, b# n( j3 u* v5 I4 g G
4 x4 {8 f, C% P/ V9 L2 L" H `% l! }
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