|
*.GTL TopLayer顶层走线& {/ D( {8 f& L
*.GBL BottomLayer底层走线
( L" u0 `9 Y. A# w *.GTO TopOverlay顶层丝印字
" {" Z7 Y. `: i) }( I ?3 s *.GBO BottomOverlay底层丝印/ I: q& ^, x2 A, D3 m- F
*.GTS TopSolder顶层阻焊. X- \ f" f+ \9 ^ t! W
*.GBS BottomSolder底层阻焊0 m& O# d1 u' _7 P( h
*.GTP TopPaste顶层贴片钢网
1 i2 D! s1 z( T. M0 R0 S *.GBP BottomPaste底层贴片钢网6 r% F9 \* s, P5 |5 t
*.GPT Top Pad Master顶层主焊盘
% ~4 N$ t- V" I( |: M# M [ *.GPB Bottom Pad Master底层主焊盘
, W) k$ {3 x2 d# [" r *.G1,*.G2,.. MidLayer1,2,..内层走线. l; Y( z: D& F8 Y
*.GP1,*.GP2,.. InternalPlane1,2,..内层平面1,2,..
. I9 q1 d" S0 o *.GM1 ,*GM2,.. Mechanical1,2,..机械层1,2,..
9 D! Z; z% f: [ *.GKO KeepOutLayer禁止布线层(可做板子外形)* `5 t( O% _: M# I! ?
*.GG1 DrillGuide钻孔位置层7 a4 m* K, ?8 J$ P6 o* A& a* v
*.GD1 DrillDrawing钻孔图层 *drill 钻孔文件
* O1 v2 s" o: E& E *.TXT 分孔图表8 @. E" l( ^* ], H a! v$ A
*.APR 光圈表文件
, u/ r+ f' W) k! e* }( A *.DRR 钻孔报告文件$ y: b9 K. I/ l+ b$ G5 e, F4 h- z
|
|