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*.GTL TopLayer顶层走线" D r6 y" z. @; Q5 }, a0 M% F
*.GBL BottomLayer底层走线 8 H+ E+ z8 @8 W; Q. Y
*.GTO TopOverlay顶层丝印字3 p" _# H3 t* j0 P9 m y6 T5 ~
*.GBO BottomOverlay底层丝印, _7 e; x, h5 g
*.GTS TopSolder顶层阻焊
6 w+ Z: D6 i* V) b *.GBS BottomSolder底层阻焊
7 ~% K) [8 g# ~! e7 U *.GTP TopPaste顶层贴片钢网
! {& b/ [5 z, f9 H- z# F/ T# a *.GBP BottomPaste底层贴片钢网& O. I& f: F7 j
*.GPT Top Pad Master顶层主焊盘
" |' y7 S2 u" I% Q *.GPB Bottom Pad Master底层主焊盘
/ K% S: k5 g/ T& `: F5 f *.G1,*.G2,.. MidLayer1,2,..内层走线
6 {& H+ R$ F: b/ s *.GP1,*.GP2,.. InternalPlane1,2,..内层平面1,2,... J+ Z: ^; ~. v; F) S
*.GM1 ,*GM2,.. Mechanical1,2,..机械层1,2,../ ?7 j$ F* d! A' r) J
*.GKO KeepOutLayer禁止布线层(可做板子外形)
^9 r# c3 U! O# @# k e *.GG1 DrillGuide钻孔位置层
6 p* U* o: X8 k *.GD1 DrillDrawing钻孔图层 *drill 钻孔文件* v$ z/ b( c8 ]- h/ P q5 s5 B9 A
*.TXT 分孔图表
. O- p: p9 Z4 `; a4 L7 H P *.APR 光圈表文件: M& q5 D$ Z+ G6 I
*.DRR 钻孔报告文件
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